| 영상 | KEY 부품 번호 / 제조업체 | 설명 / PDF | 수량 / RFQ |
|---|---|---|---|
 |
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY. |
1435PC 주식 |
 |
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products T-flex 580 9" X 9" X 0.080" |
1438PC 주식 |
 |
Laird Technologies - Thermal Materials |
THERM PAD 19.05MMX12.7MM GRAY. |
212548PC 주식 |
 |
t-Global Technology |
THERM PAD 40MMX40MM W/ADH BLACK. |
212548PC 주식 |
 |
Laird Technologies - Thermal Materials |
THERM PAD 25.4MMX19.05MM BROWN. Thermal Interface Products Tgard 500,A0 Kit TO247 |
61527PC 주식 |
 |
Parker Chomerics |
CHO-THERM 1671 TO-220. |
49221PC 주식 |
 |
t-Global Technology |
THERM PAD 25MMX25MM RED. |
23438PC 주식 |
 |
Bergquist |
THERM PAD 406.4MMX203.2MM BLUE. Thermal Interface Products BERGQUIST GAP PAD TGP HC3000 |
1581PC 주식 |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 560 DC1 9x9" 2.8W/mK gap filler |
1583PC 주식 |
 |
Bergquist |
THERM PAD 33.32MMX19.35MM GRAY. Thermal Interface Products The Original Sil-Pad Material, 0.009" Thickness, 33.32x19.35x3.56x1.57", Sil-Pad TSP 900 Series / Also Known as Bergquist Sil-Pad 400 Series |
374084PC 주식 |
|
Bergquist |
GAPPAD VO SOFT 8X16. |
1623PC 주식 |
 |
Bergquist |
THERM PAD 19.05MMX12.7MM BLACK. Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 0.006" Thickness, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series, Q2-54, BG40256, 2188993 |
137531PC 주식 |
|
Bergquist |
THERM PAD 406.4MMX203.2MM BLUE. |
1634PC 주식 |
 |
t-Global Technology |
THERM PAD 18.03MMX12.7MM W/ADH. |
103911PC 주식 |
|
Bergquist |
THERM PAD 406.4MMX203.2MM BLACK. Thermal Interface Products BERGQUIST GAP PAD TGP 1500 |
1677PC 주식 |
 |
Aavid, Thermal Division of Boyd Corporation |
THERM PAD 39.65MMX26.67MM. Thermal Interface Products Thermalsil III Thermal Pad for TO-3, Rhombus, Beryllium Oxide Ceramic, 39.65x26.67x 1.575mm |
4311PC 주식 |
 |
Bergquist |
THERM PAD 19.05MMX12.7MM PINK. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, 19.05x12.7mm, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Series |
292254PC 주식 |
 |
t-Global Technology |
THERM PAD 20MMX10MM YELLOW. |
623475PC 주식 |
 |
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey |
32699PC 주식 |
 |
3M (TC) |
THERM PAD 25MMX25MM WHITE. |
27185PC 주식 |
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