| 영상 | KEY 부품 번호 / 제조업체 | 설명 / PDF | 수량 / RFQ |
|---|---|---|---|
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Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Grey |
14634PC 주식 |
 |
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Green |
32248PC 주식 |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Grey |
18445PC 주식 |
 |
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Gold |
32699PC 주식 |
 |
Wakefield-Vette |
THERM PAD 2.106 X 2.106. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 2.106 Inch x 2.106 Inch, No Hole |
55666PC 주식 |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold |
25276PC 주식 |
 |
Wakefield-Vette |
THERM PAD TO-218 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-218 Pad with Hole |
190859PC 주식 |
 |
Wakefield-Vette |
THERM PAD 1.516 X 1.516. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.516 Inch x 1.516 Inch, No Hole |
87402PC 주식 |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Green |
34131PC 주식 |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Green |
16790PC 주식 |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Green |
10425PC 주식 |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Gold |
7677PC 주식 |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft |
32248PC 주식 |
|
Wakefield-Vette |
THERM PAD 1.811 X 1.811. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.811 Inch x 1.811 Inch, No Hole |
77289PC 주식 |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft |
29225PC 주식 |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Gold, Hyper Soft |
34131PC 주식 |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Gold |
14454PC 주식 |
|
Wakefield-Vette |
THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole |
112675PC 주식 |
|
Wakefield-Vette |
THERM PAD 1.909 X 1.909. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.909 Inch x 1.909 Inch, No Hole |
61527PC 주식 |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Gold, Hyper Soft |
7392PC 주식 |
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