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4-1542005-3

TE Connectivity AMP Connectors

27MM HS ASSY ULTEM CL.

8752PC 주식

4-1542005-6

TE Connectivity AMP Connectors

27MM HS ASSY ULTEM CL.

8751PC 주식

3-1542003-8

TE Connectivity AMP Connectors

40MM HS ASSY ULTEM CL.

8751PC 주식

8-1542001-7

TE Connectivity AMP Connectors

HS ASSY A-TEMP CLIP.

13654PC 주식

9-1542000-6

TE Connectivity AMP Connectors

25MM HS ASSY ULTEM CL.

8751PC 주식

DA-T263-101E

DA-T263-101E

Ohmite

HEATSINK FOR TO-263 BLACK.

8750PC 주식

DV-T263-101E

DV-T263-101E

Ohmite

HEATSINK FOR TO-263. Heat Sinks HEATSINK FOR TO-263 DEGREASED

8750PC 주식

501000B00000G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK.

8750PC 주식

568303B00000G

568303B00000G

Aavid, Thermal Division of Boyd Corporation

HEATSINK TO-3 1.25 25WATT. Heat Sinks Board Level Stamped Heatsink for TO-3, Horizontal Mounting, Black Anodized, 45.97x45.97x31.75mm

15205PC 주식

506902B00000G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks Hat Section Style Heatsink for TO-220, Vertical Mounting, 20 n Thermal Resistance, Black Anodized, 31.75mm

8748PC 주식

574802B03700G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks Board Level Heatsink for TO-220, TO-220-Single Gauge 0.020 Inch, Vertical Mounting, 10.67x25.91x22.86mm

8748PC 주식

832700T00000

832700T00000

Comair Rotron

HEATSINK STAMP 26.2X12.7X9.9MM.

8748PC 주식

821002B04000

821002B04000

Comair Rotron

HEATSINK STAMP 6.4X13.3X19.1MM.

8748PC 주식

831402B00000

831402B00000

Comair Rotron

HEATSINK STAMP 19X12.8X12.7MM.

8747PC 주식

833202B04800

833202B04800

Comair Rotron

HEATSINK STAMP 10X21.2X19MM.

112675PC 주식

811102B00000

811102B00000

Comair Rotron

HEATSINK STAMP 22.2X5.4X30.3MM.

13654PC 주식

831502B03900

831502B03900

Comair Rotron

HEATSINK STAMP 19X12.8X12.7MM.

8747PC 주식

831302B00000

831302B00000

Comair Rotron

HEATSINK STAMP 19X12.8X12.7MM.

8745PC 주식

831502B03700

831502B03700

Comair Rotron

HEATSINK STAMP 19X12.8X12.7MM.

8745PC 주식

374624B00032G

374624B00032G

Aavid, Thermal Division of Boyd Corporation

HEATSINK BGA 35X35X10MM W/ADH. Heat Sinks Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x10mm, IC Pkg Size = 35 x 35, Tape #32

13005PC 주식