| 영상 | KEY 부품 번호 / 제조업체 | 설명 / PDF | 수량 / RFQ |
|---|---|---|---|
 |
Bergquist |
THERM PAD 15.87MMX5.08MM GREEN. |
1042602PC 주식 |
 |
Bergquist |
THERM PAD 41.91MMX28.96MM W/ADH. |
413445PC 주식 |
 |
Bergquist |
THERM PAD 19.05MMX12.7MM W/ADH. |
242597PC 주식 |
 |
Bergquist |
THERM PAD 19.05MMX12.7MM PINK. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, 19.05x12.70x4.75x3.73mm, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Ser |
203307PC 주식 |
 |
Bergquist |
THERM PAD 31.75MMX31.75MM BEIGE. Thermal Interface Products The High Performance Polyimide-Based Insulator, 0.006" Thickness, 31.75x31.75x5.08mm, Sil-Pad TSP K1300 Series / Also Known as Bergquist Sil-Pad K-10 Series |
67768PC 주식 |
 |
Bergquist |
THERM PAD 19.05MMX12.7MM BEIGE. Thermal Interface Products The High Performance Polyimide-Based Insulator, 0.006" Thickness, 19.05x12.7mm, Sil-Pad TSP K1300 Series / Also Known as Bergquist Sil-Pad K-10 Series |
190859PC 주식 |
 |
Laird Technologies - Thermal Materials |
TFLEX P340 18.00X18.00IN. Thermal Interface Products Tflex P340 18.00x18. 00in, |
417PC 주식 |
 |
Bergquist |
THERM PAD 101.6MMX101.6MM BLACK. |
8478PC 주식 |
 |
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX457.2MM PINK. Thermal Interface Products Tflex HD3130 18x18 |
274PC 주식 |
|
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX457.2MM PINK. Thermal Interface Products Tflex HD3170 DC1 18x18 |
231PC 주식 |
|
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX457.2MM PINK. Thermal Interface Products Tflex HD740 18x18 |
264PC 주식 |
 |
Bergquist |
THERM PAD 406.4MMX203.2MM W/ADH. Thermal Interface Products BERGQUIST GAP PAD TGP 1000VOUS |
823PC 주식 |
|
Laird Technologies - Thermal Materials |
TFLEX HD3180 DC1 18X18 COATED. EMI Gaskets, Sheets, Absorbers & Shielding Tflex HD3180,DC1 18.00x18.00in |
218PC 주식 |
 |
Bergquist |
THERM PAD 41.91MMX28.96MM BLACK. |
799327PC 주식 |
 |
Bergquist |
THERM PAD 21.84MMX18.8MM BEIGE. Thermal Interface Products The High Performance Polyimide-Based Insulator, 0.006" Thickness, 21.84x18.80x5.08x4.06mm, Sil-Pad TSP K1300 Series / Also Known as Bergquist Sil-Pad K-10 Series |
137531PC 주식 |
|
Bergquist |
THERM PAD 11.1MMX7.92MM PINK. |
458437PC 주식 |
|
Laird Technologies - Thermal Materials |
TFLEX P330 18.00X18.00IN. Thermal Interface Products Tflex P330 18.00x18. 00in, |
550PC 주식 |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM PINK. Thermal Interface Products Tflex HD740 DC1 9x9 IN |
992PC 주식 |
 |
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM PINK. Thermal Interface Products Tflex HD3160 9x9 |
971PC 주식 |
 |
Bergquist |
THERM PAD 19.05MMX12.7MM PINK. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, 19.05x12.7x4.75x3.73mm, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Seri |
322487PC 주식 |
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