영상 | KEY 부품 번호 / 제조업체 | 설명 / PDF | 수량 / RFQ |
---|---|---|---|
3M (TC) |
THERM PAD 10M X 76.2MM W/ADH WHT. |
1121PC 주식 |
|
3M (TC) |
THERMALLY CONDUCTIVE 3 X 10M. |
301PC 주식 |
|
Bergquist |
THERM PAD 304.8MMX304.8MM W/ADH. |
4321PC 주식 |
|
Bergquist |
THERM PAD 406.4MMX203.2MM YELLOW. Thermal Interface Products BERGQUIST GAP PAD TGP 2400 |
224PC 주식 |
|
Bergquist |
THERM PAD 406.4MMX203.2MM BLACK. Thermal Interface Products BERGQUIST GAP PAD TGP 1500R |
2989PC 주식 |
|
Panasonic Electronic Components |
THERM PAD 35MMX35MM W/ADH BLACK. Thermal Interface Products Graphite-PAD 3.0mm 35mmx35mm |
8635PC 주식 |
|
Bergquist |
THERM PAD 19.05MMX12.7MM GRAY. Thermal Interface Products The Original Sil-Pad Material, 0.007" Thickness, 19.05x12.7x4.75x3.73mm, Sil-Pad TSP 900 Series / Also Known as Bergquist Sil-Pad 400 Series |
584508PC 주식 |
|
Bergquist |
THERM PAD 33.32MMX19.35MM BEIGE. Thermal Interface Products The High Performance Polyimide-Based Insulator, 0.006" Thickness, Sil-Pad TSP K1300 Series / Also Known as Bergquist Sil-Pad K-10 Series |
208519PC 주식 |
|
Laird Technologies - Thermal Materials |
TFLEX HD3140 DC1 18X18 COATED. EMI Gaskets, Sheets, Absorbers & Shielding Tflex HD3140,DC1 18.00x18.00in |
266PC 주식 |
|
Bergquist |
THERM PAD 25.4MMX19.05MM WHITE. |
58086PC 주식 |
|
Bergquist |
THERM PAD 19.05MMX12.7MM W/ADH. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, Adhesive - One Side, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Series |
313304PC 주식 |
|
Laird Technologies - Thermal Materials |
TFLEX P3140 18.00X18.00IN. Thermal Interface Products Tflex P3140 18.00x18 .00in, |
126PC 주식 |
|
Bergquist |
THERM PAD 22.15MMX20.07MM W/ADH. |
899243PC 주식 |
|
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX457.2MM PINK. Thermal Interface Products Tflex HD3150.DC1 18x18 |
259PC 주식 |
|
Bergquist |
THERM PAD 22.15MMX20.07MM W/ADH. Thermal Interface Products Higher Performance, High Reliability Insulator, 0.010" Thickness, Adhesive - One Side, Sil-Pad TSP 3500 Series / Also Known as Bergquist Sil-Pad 2000 Series, 2010AC-124 |
67768PC 주식 |
|
Bergquist |
THERM PAD 21.84MMX18.8MM GRAY. Thermal Interface Products The Original Sil-Pad Material, 0.009" Thickness, 21.84x18.80x5.08x4.06mm, Sil-Pad TSP 900 Series / Also Known as Bergquist Sil-Pad 400 Series |
492217PC 주식 |
|
Bergquist |
THERM PAD 25.4MMX19.05MM GRAY. Thermal Interface Products The Original Polyimide-Based Insulator, 0.006" Thickness, Sil-Pad TSP K900 Series / Also Known as Bergquist Sil-Pad K-4 Series |
292254PC 주식 |
|
Bergquist |
THERM PAD 41.91MMX28.96MM GRAY. Thermal Interface Products The Original Sil-Pad Material, 0.009" Thickness, 1.650x1.140x0.122x0.062", Sil-Pad TSP 900 Series / Also Known as Bergquist Sil-Pad 400 Series |
856423PC 주식 |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM PINK. Thermal Interface Products Tflex HD7100 9x9 in |
528PC 주식 |
|
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX457.2MM PINK. Thermal Interface Products Tflex HD7100 DC1 18x18 IN |
124PC 주식 |