해당 지역이 목록에 없으면 다음 중 하나를 선택하십시오.:

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해당 지역이 목록에 없으면 다음 중 하나를 선택하십시오.:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. KLMBG2JETD-B041

Samsung Semiconductor - KLMBG2JETD-B041

KEY Part #: K7360040

[23162PC 주식]

    부품 번호:
    KLMBG2JETD-B041
    제조사:
    Samsung Semiconductor
    상세 설명:
    eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.
    제조업체의 표준 리드 타임:
    재고
    수명:
    일년
    칩 출처:
    홍콩
    RoHS:
    결제 방법:
    배송 방법:
    가족 카테고리:
    KEY Components Co., LTD는 다음을 포함하여 제품 카테고리를 제공하는 전자 부품 유통 업체입니다. SLC Nand, GDDR5, GDDR6, HBM Aquabolt, DDR3, LPDDR4X, LPDDR3 and MODULE ...
    경쟁 우위:
    We specialize in Samsung Semiconductor KLMBG2JETD-B041 electronic components. KLMBG2JETD-B041 can be shipped within 24 hours after order. If you have any demands for KLMBG2JETD-B041, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    KLMBG2JETD-B041 제품 속성

    부품 번호 : KLMBG2JETD-B041
    제조사 : Samsung Semiconductor
    기술 : eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production
    시리즈 : DDR3
    번역 : eMMC 5.1
    밀도 : 32 GB
    전압 : 1.8, 3.3 V / 3.3 V
    인터페이스 : HS400
    패키지 크기 : 11.5 x 13 x 0.8 mm
    온도. : -25 ~ 85 °C
    제품 상태 : Mass Production

    최근 소식

    Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
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    Driving the Artificial Intelligence Evolution with In-Memory Computing
    Samsung Electronics Takes 3D Memory to New Heights with Sixth-generation V-NAND SSDs for Client Computing
    Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology
    Automotive Driven by Small Packages Under the Hood
    An Exclusive Look Inside Samsung’s Memory Exhibit at MWC
    Evolving Mobile Solutions: Samsung at MWC 2018
    5G and Memory - from Connected Thinking to Connected Living
    Bringing Artificial Intelligence to Devices Everywhere
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
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