해당 지역이 목록에 없으면 다음 중 하나를 선택하십시오.:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski

해당 지역이 목록에 없으면 다음 중 하나를 선택하십시오.:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. 집
  2. 제품
  3. DRAM
  4. MODULE
  5. M393AAG40M32-CAE

Samsung Semiconductor - M393AAG40M32-CAE

KEY Part #: K7359910

[21143PC 주식]

    부품 번호:
    M393AAG40M32-CAE
    제조사:
    Samsung Semiconductor
    상세 설명:
    DDR4 RDIMM 128 GB 4R x 4 3200 Mbps 1.2 V 288 (3DS 2H 8G x 4) x 36 Sample.
    제조업체의 표준 리드 타임:
    재고
    수명:
    일년
    칩 출처:
    홍콩
    RoHS:
    결제 방법:
    배송 방법:
    가족 카테고리:
    KEY Components Co., LTD는 다음을 포함하여 제품 카테고리를 제공하는 전자 부품 유통 업체입니다. LPDDR3, MODULE, LPDDR5, GDDR5, HBM Aquabolt, DDR4, SLC Nand and LPDDR4X ...
    경쟁 우위:
    We specialize in Samsung Semiconductor M393AAG40M32-CAE electronic components. M393AAG40M32-CAE can be shipped within 24 hours after order. If you have any demands for M393AAG40M32-CAE, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    M393AAG40M32-CAE 제품 속성

    부품 번호 : M393AAG40M32-CAE
    제조사 : Samsung Semiconductor
    기술 : DDR4 RDIMM 128 GB 4R x 4 3200 Mbps 1.2 V 288 (3DS 2H 8G x 4) x 36 Sample
    시리즈 : DDR3
    DDR : DDR4
    DIMM 유형 : RDIMM
    밀도 : 128 GB
    순위는 조직을 X. : 4R x 4
    속도 : 3200 Mbps
    전압 : 1.2 V
    핀의 번호 : 288
    구성 요소 구성 : (3DS 2H 8G x 4) x 36
    제품 상태 : Sample

    최근 소식

    Evolving Mobile Solutions: Samsung at MWC 2018
    Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones
    Exploring the Key Samsung Technologies That Enabled 10nm-Class DRAM
    NF1 SSD, Reach New Heights with Hyper-Scalable Datacenters
    Speed for the next generation of mobile devices
    Inside the building blocks of the 5G future
    How Will 5G Impact on Memory?
    Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    [Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions
    Driving the Artificial Intelligence Evolution with In-Memory Computing
    Automotive Driven by Small Packages Under the Hood
    당신은 또한 관심이있을 수 있습니다
    • MZPJB800HMGC

      Samsung Semiconductor

      SZ985 PCIe Gen3 x4 HHHL 800 GB 3400 MB/s 3000 MB/s 750K IOPS 170K IOPS Mass Production.

    • MZILT1T9HAJQ

      Samsung Semiconductor

      PM1643 SAS 12.0 Gbps 2.5 inch 1.92 TB 2100 MB/s 1800 MB/s 440K IOPS 46K IOPS 1(5yrs) Mass Production.

    • MZILT3T8HALS

      Samsung Semiconductor

      PM1643 SAS 12.0 Gbps 2.5 inch 3.84 TB 2100 MB/s 2000 MB/s 450K IOPS 58K IOPS 1(5yrs) Mass Production.

    • MZILT7T6HMLA

      Samsung Semiconductor

      PM1643 SAS 12.0 Gbps 2.5 inch 7.68 TB 2100 MB/s 2000 MB/s 400K IOPS 70K IOPS 1(5yrs) Mass Production.

    • MZILT960HAHQ

      Samsung Semiconductor

      PM1643 SAS 12.0 Gbps 2.5 inch 960 GB 2100 MB/s 1000 MB/s 350K IOPS 30K IOPS 1(5yrs) Mass Production.

    • MZPLL12THMLA

      Samsung Semiconductor

      PM1725b PCIe Gen3 x8 HHHL 12.8 TB 6300 MB/s 3300 MB/s 940K IOPS 110K IOPS 3(5yrs) Mass Production.

    뜨거운 부품