해당 지역이 목록에 없으면 다음 중 하나를 선택하십시오.:

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해당 지역이 목록에 없으면 다음 중 하나를 선택하십시오.:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. K4UBE3D4AA-MGCL

Samsung Semiconductor - K4UBE3D4AA-MGCL

KEY Part #: K7359748

[17741PC 주식]

    부품 번호:
    K4UBE3D4AA-MGCL
    제조사:
    Samsung Semiconductor
    상세 설명:
    32 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 200FBGA Mass Production.
    제조업체의 표준 리드 타임:
    재고
    수명:
    일년
    칩 출처:
    홍콩
    RoHS:
    결제 방법:
    배송 방법:
    가족 카테고리:
    KEY Components Co., LTD는 다음을 포함하여 제품 카테고리를 제공하는 전자 부품 유통 업체입니다. LPDDR5, GDDR5, DDR4, MODULE, HBM Flarebolt, LPDDR3, LPDDR4 and SLC Nand ...
    경쟁 우위:
    We specialize in Samsung Semiconductor K4UBE3D4AA-MGCL electronic components. K4UBE3D4AA-MGCL can be shipped within 24 hours after order. If you have any demands for K4UBE3D4AA-MGCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4UBE3D4AA-MGCL 제품 속성

    부품 번호 : K4UBE3D4AA-MGCL
    제조사 : Samsung Semiconductor
    기술 : 32 Gb x32 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 200FBGA Mass Production
    시리즈 : DDR3
    밀도 : 32 Gb
    조직. : x32
    속도 : 4266 Mbps
    전압 : 1.8 / 1.1 / 0.6 V
    온도. : -25 ~ 85 °C
    꾸러미 : 200FBGA
    제품 상태 : Mass Production

    최근 소식

    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
    Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones
    Autonomous Driving and the Quest for Safety
    Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones
    Unlocking the Power of Cloud Computing
    Inside the building blocks of the 5G future
    [Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions
    An Exclusive Look Inside Samsung’s Memory Exhibit at MWC
    SSDs, DRAM and gaming: Unlocking a new level of performance
    Samsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process Technology
    The Ultra-Low Latency SSD, Z-SSD
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      DDR4 UDIMM 8 GB 1R x 8 2666 Mbps 1.2 V 288 (1G x 8) x 8 Mass Production.

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